Semiconductor device, related manufacturing method, and related electronic device
US10615259B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2017 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Apr 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/307
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device may include the following elements: a first doped portion; a second doped portion; an enclosing member, which encloses both the first doped portion and the second doped portion; a first barrier, which directly contacts the first doped portion; a second barrier, which directly contacts the second doped portion; a dielectric member, which is positioned between the first barrier and the second barrier and directly contacts each of the first barrier and the second barrier; a third barrier, which directly contacts the first doped portion; and a device component, wherein a portion of the device component is positioned between the dielectric member and the third barrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.