Component having a reflector and method of producing components
US10615323B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2017 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Apr 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0363
Abstract
A component includes a semiconductor chip, an envelope and a reflector, wherein the semiconductor chip has a front side, a rear side facing away from the front side and side faces, and the semiconductor chip is electrically contactable at least partially via its rear side, the reflector completely encloses the semiconductor chip in lateral directions, has a first subregion and a second subregion directly adjoining the first subregion, and the first subregion is spatially spaced from the semiconductor chip and the second subregion directly adjoins the semiconductor chip, the envelope covers the front side of the semiconductor chip completely and the side surfaces of the semiconductor chip at least partially so that the envelope has an interface facing the semiconductor chip and reproducing a contour of the semiconductor chip in regions, and in the component is free of a lead frame enclosed by a molded body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.