Electronic device with conductive structure directly abutting metal frame to ground bracket
US10615525B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2019 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Sep 27, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2107/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic device is provided. The electronic device includes a substrate, a connector, a ground bracket and a conductive structure. The substrate includes a ground layer. The connector is disposed on the substrate, wherein the connector includes a metal frame. The ground bracket is affixed on the substrate and coupled to the ground layer, wherein at least a portion of the connector is located in the ground bracket. The conductive structure is adapted to abut the metal frame and to abut the ground bracket, wherein when the conductive structure connects the metal frame to the ground bracket, the conductive structure electrically connects the ground bracket to the metal frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.