Lead component mounting machine and lead component mounting method
US10617013B2 · kind B2 · utility
3Cited by
10References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 20, 2014 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Mar 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0473
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A lead component mounting machine is provided in which lead wires are pinched and held from both sides by a pair of pawl portions, and the lead wires are inserted into through-holes of a board. The holding by the pawl portions is loosened, and a component main body is pushed in by a pushing-in device until the component main body comes into contact with the pawl portions. Subsequently, the strength of the holding by the pawl portions is increased, and the cutting and clinching of the lead wires is performed. Sliding movement of the lead wires is in a state of being suppressed by the pawl portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.