Apparatuses, systems, and methods for improved heat dissipation
US10617036B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2019 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Jan 28, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20945
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A computing device includes a housing having an inner surface, a first outer surface, a second outer surface, and a side extending between the first outer surface and the second outer surface. The computing device also includes a heat generating electronic device, a first heat spreader, and a second heat spreader. At least a portion of the first heat spreader abuts or is adjacent to the inner surface of the housing. The second heat spreader extends from a first position within the housing, at or adjacent to the heat generating electronic device to a second position within the housing. The second position is closer to the side of the housing than the first position. A first portion of the second heat spreader abuts the first heat spreader, and a second portion of the second heat spreader is at a distance from the first heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.