Heat treatment to anneal residual stresses during additive manufacturing
US10618111B2 · kind B2 · utility
5Cited by
2References
9Claims
0Family size
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Key dates
| Filing date | Jan 28, 2016 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Nov 4, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An additive manufacturing system having a heat source for melting powder particles in a desired shape and pattern to produce a product. A secondary heat source is used for heat treating the product to achieve heat treatment. The secondary heat source is used to peen or anneal residual stresses caused by the additive manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.