Grinding method, OGS substrate and manufacturing method of OGS mother substrate
US10618143B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 20, 2017 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Sep 23, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04107
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A grinding method, an OGS substrate and a manufacturing method of an OGS mother substrate are provided. The grinding method is used to grind the OGS substrate comprising a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.