Functional film laminate
US10618232B2 · kind B2 · utility
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1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2015 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Apr 5, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B1/14
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
This invention relates to the development of a multi-layer PC polar laminate and its cut and form process. The laminate displays increased adhesion between a PC film layer and an adjacent film layer. As a result of the increased adhesion, less adhesive may be applied between laminate layers, which positively affects PC cracking and mold cavity contamination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.