MEMS structure with bilayer stopper and method for forming the same
US10618801B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2016 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Nov 30, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0735
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Microelectromechanical systems (MEMS) packages and methods for forming the same are provided. The MEMS package includes a semiconductor substrate having a metallization layer over the semiconductor substrate. The MEMS package also includes a first planarization layer and an overlying second planarization layer over the metallization layer. The planarization structure has a first cavity therein exposing the metallization layer. The MEMS package also includes a MEMS device structure bonded to the second planarization layer. The MEMS device structure includes a moveable element over the first cavity. The MEMS package also includes a first stopper placed on the exposed metallization layer in the first cavity. The first stopper includes a patterned conductive layer and an underlying patterned insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.