Catalyst ink for three-dimensional conductive constructs
US10619059B1 · kind B1 · utility
3Cited by
11References
18Claims
0Family size
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Key dates
| Filing date | Jun 20, 2019 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Jun 20, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of constructing conductive material in arbitrary three-dimensional (3D) geometries, such as 3D printing. The method may include selective application of an aerosol-based colloidal solution containing a catalytic palladium nanoparticle material onto a substrate and then immersion of the coated substrate into an electro-less plating bath for deposition of conductive copper material. The above steps may be repeated to create arbitrary 3D geometric constructs containing conductive metallic patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.