Patent · US Active

Metallic nanoparticle dispersion

US10619066B2 · kind B2 · utility

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0References
17Claims
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Key dates

Filing dateJul 1, 2014
Grant dateApr 14, 2020
Priority date
Expiry dateDec 4, 2035

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08K5/20
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

A metallic nanoparticle dispersion includes metallic nanoparticles and less than 50 μmol/g metal of an inorganic acid or a compound capable of generating such an acid during curing of a metallic layer or pattern formed from the dispersion. The presence of such small amounts an inorganic acid increases the conductivity of metallic layers or patterns formed from the metallic nanoparticle dispersions at moderate curing conditions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.