Metallic nanoparticle dispersion
US10619066B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Jul 1, 2014 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Dec 4, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/20
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A metallic nanoparticle dispersion includes metallic nanoparticles and less than 50 μmol/g metal of an inorganic acid or a compound capable of generating such an acid during curing of a metallic layer or pattern formed from the dispersion. The presence of such small amounts an inorganic acid increases the conductivity of metallic layers or patterns formed from the metallic nanoparticle dispersions at moderate curing conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.