Hot melt adhesive composition
US10619081B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2018 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Jul 31, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/035
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A hot melt adhesive composition that includes a first ethylene alpha-olefin copolymer having a density of no greater than 0.90 grams per cubic centimeter, a second styrene block copolymer, tackifying agent, synthetic wax having a melt temperature of at least 70° C. and a heat of fusion of at least 200 Joules/gram, and a third polymer selected from the group consisting of ethylene-polar comonomer copolymer derived from at least 90 mole % ethylene and no greater than 10 mole % co-monomer, propylene-alpha-olefin copolymer derived from at least 8 mole % co-monomer, exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g, and having a polydispersity index of no greater than 10, and propylene homopolymer exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.