Pollution-free electroplating solution for electroplating and preparation method thereof
US10619259B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | May 3, 2018 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Nov 2, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/665
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This disclosure discloses a pollution-free electroplating solution for electroplating and its preparation method. The process of the preparation method includes: mixing choline chloride with nitrogenous compounds in molar ratio of 1:2, heating to 80° C. to form uniform ionic liquid, adding metal chloride into ionic liquid with molar concentration between 0.005M to 0.5 M, adding 7˜11 wt % of bio bacteria and 0.7M˜2M of inorganic acid agent into the mixed liquid. After been mixed thoroughly, this pollution-free electroplating solution is ready for the application in electroplating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.