Panel for forming a floor covering, method for manufacturing such panels and granulate applied herewith
US10619357B2 · kind B2 · utility
19Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2017 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Dec 21, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24868
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing panels with at least a substrate and a top layer. The method having the steps of providing a granulate having thermoplastic material and having an average particle size of less than 1 millimeter, forming a substrate layer by strewing the granulate, consolidating the layer between the belts of a continuous press device, and providing the top layer on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.