High-power LED lamp with heat dissipation effect
US10619842B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 14, 2019 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | May 14, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention belongs to the technical field of high-power LED lamps, and relates to a high-power LED lamp with a heat dissipation effect, including a shell body. The shell body includes a heat sink main body and a heat sink cover board covering on a back surface of the heat sink main body. A plurality of heat pipes are embedded between the heat sink main body and the heat sink cover board, and an LED chip is placed on a front surface of the heat sink main body. The position of the heat sink main body where the LED chip is placed is the chip heat collecting area, all the heat pipes pass under the chip heat collecting area, and are in close contact with the chip heat collecting area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.