Heating device for hot stamping
US10619925B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 16, 2018 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Apr 16, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D9/46
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of heating for hot stamping is configured to heat a plated metallic material while conveying the plated metallic material. A heating device for hot stamping comprises: a first heating tank provided in a conveyance path for the plated metallic material; and a second heating tank provided downstream of the first heating tank in the conveyance path. A heating amount provided by the second heating tank is configured such that a temperature of the plated metallic material becomes equal to or higher than Ac3 point and less than a boiling point of a plating of the plated metallic material, and a heating amount provided by the first heating tank is configured to be larger than the heating amount provided by the second heating tank.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.