Patent · US Active

Method for laser microdissection

US10621411B2 · kind B2 · utility

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0References

10Claims

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Assignee

LEICA MICROSYSTEMS CMS GMBH · DE

Inventors

Falk Schlaudraff · Hausen, DE
Andrew Lee · Houston, US
Florian Hoffmann · Ladenburg, DE

Key dates

Filing date	Jan 19, 2015
Grant date	Apr 14, 2020
Priority date	—
Expiry date	Nov 14, 2037

Classification

Technology area (CPC G)Physics
CPC primaryG01N2001/2886
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method for laser microdissection includes detecting at least a portion of an object to be dissected in an image-producing manner in a laser microdissection system and generating a first digital object image. A first processing specification is defined based on the first digital object image. In a first processing step, the object is processed using a laser beam of the laser microdissection system in accordance with the first processing specification. At least a portion of the object is detected in an image-producing manner and a second digital object image is generated. A second processing specification is defined during execution of the first processing step based on the second digital object image. In a second processing step, the object is processed using the laser beam of the laser microdissection system in accordance with the second processing specification.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.