Composite electronic component and board having the same
US10622147B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2018 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Aug 6, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A composite electronic component includes a composite body that includes a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes are disposed on both end portions of the first ceramic body. The ceramic chip is disposed on a lower portion of the multilayer ceramic capacitor and includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. A plurality of electrodes are disposed in the second ceramic body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.