Substrate processing apparatus and nozzle cleaning method
US10622225B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2017 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Feb 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The controller of a substrate processing apparatus carries out a liquid column forming step in which cleaning liquid is discharged through a lower surface nozzle when a spin chuck is not holding a substrate, to form a liquid column extending upward from the lower surface nozzle, and, in parallel with the liquid column forming step, a first dropping portion cleaning step in which an upper surface nozzle is reciprocated horizontally between a first position where a dropping portion of the upper surface nozzle does not contact the liquid column and a second position where the dropping portion of the upper surface nozzle does not contact the liquid column, so as to cause the upper surface nozzle to pass through a first middle position where the upper discharge port of the upper surface nozzle overlaps with the liquid column in a plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.