Semiconductor device
US10622280B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 8, 2019 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Feb 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4068
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor element, a cooler, and a heat conductive body. The cooler faces one surface of the semiconductor element, and has a flow passage of a coolant. As viewed from the flow direction of the coolant, a width of the flow passage is wider than a width of the semiconductor element. The heat conductive body is made from graphite having such an anisotropy that a heat conductivity in the in-plane direction of a predetermined surface is higher than a heat conductivity in the normal direction of the predetermined surface. The width of the heat conductive body is wider than the width of the semiconductor element as viewed from the flow direction of the coolant. The heat conductive body is configured such that the predetermined surface is non-parallel to both of the flow direction of the coolant and the one surface of the semiconductor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.