Patent · US Active

Systems and methods for cooling an electronic device

US10622282B2 · kind B2 · utility

2Cited by

46References

20Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Rupal Govindbhai PRAJAPATI · San Diego, US
Shujuan Wang · San Diego, US
Peng WANG · Beijing, CN

Key dates

Filing date	Jul 28, 2017
Grant date	Apr 14, 2020
Priority date	—
Expiry date	Jul 28, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH10F39/804
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An apparatus for cooling an electronic device is disclosed. In an aspect, the apparatus includes a vapor chamber coupled to a heat generating component of the electronic device. In an aspect, the vapor chamber is coupled to an inner surface of an outer cover of the electronic device and conforms to a shape of the inner surface of the outer cover. In another aspect, the vapor chamber forms the outer cover of the electronic device. The vapor chamber comprises a sealed container, a wick structure disposed on an inner surface of the sealed container, and a fluid contained in the sealed container, wherein as heat is applied to an evaporator side of the sealed container coupled to the heat generating component, the fluid vaporizes over a condenser side of the sealed container opposite the evaporator side and returns to the evaporator side via the wick structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.