Semiconductor package
US10622287B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2018 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Sep 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package is provided, including: a package body; and a plurality of lead terminals exposed from each of at least three side surfaces of the package body, wherein the plurality of lead terminals include: a plurality of lead terminals exposed from a first side surface, half or more of which have tips pointing in a direction along the first side surface; a plurality of lead terminals exposed from a second side surface, all of which have tips pointing in a direction along a direction orthogonal to the second side surface; and a plurality of lead terminals exposed from a third side surface, half or more of which have tips pointing in a direction along the third side surface, or all of which have tips pointing in a direction along a direction orthogonal to the third side surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.