Transmission line structure with high Q factor and low insertion loss for millimeter wave applications
US10622309B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2018 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Oct 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a transmission line structure embedded in a back-end-of-line (BEOL) body that has a cavity. The transmission line structure includes a signal transmission line, a ground plane and a shielding line. The signal transmission line and the first shielding line are formed on a same metallization level, and the ground plane is formed underneath and electrically connected to the first shielding line. A side surface of the signal transmission line and a side surface of the first shielding line, which faces the side surface of the signal transmission line, are exposed to the cavity of the BEOL body, and not covered by any high resistivity conductive coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.