Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component

US10622331B2 · kind B2 · utility

Assignee

• HERAEUS DEUTSCHLAND GMBH & CO. KG · DE

Inventors

• Andreas Hinrich · Alzenau, DE
• Susanne Klaudia DUCH · Bruchköbel, DE
• Anton-Zoran MIRIC · Alzenau, DE
• Michael Schäfer · Hüttenberg, DE
• Christian Bachmann · Hersbruck, DE
• Holger Ulrich · Nortorf, DE
• Frank Osterwald · Kiel, DE
• David Benning · Nordborg, DK
• Jacek Rudzki · Kiel, DE
• Lars Paulsen · Hollingstedt, DE
• Frank Schefuss · Nordborg, DK
• Martin Becker · Kiel, DE

Key dates

• Filing date: Sep 28, 2016
• Grant date: Apr 14, 2020
• Expiry date: Sep 28, 2036

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

One aspect relates to a method for manufacturing a substrate assembly for attachment to an electronic componentA substrate is provided with a first side and a second side.A contact material layer is applied to the first side of the substrate.A pre-fixing agent is applied at least to sections of a side of the contact material layer facing away from the substrate.