Optoelectronic component and method of producing an optoelectronic component
US10622494B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2018 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | May 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optoelectronic component includes a housing body comprising a mounting face and a leadframe embedded into the housing body. The leadframe comprises a first and a second leadframe section, wherein the leadframe sections each comprise a contact region and a terminal region. While the contact regions are exposed at the mounting face, the terminal regions project laterally from the housing body. The housing body is completely enclosed by a molding material, wherein the terminal regions are not enclosed by the molding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.