Bendable electronic device modules, articles and methods of making the same
US10622581B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2016 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Oct 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/311
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A foldable electronic device module includes a glass cover element having a thickness from about 25 μm to about 200 μm, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 μm and about 600 μm; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.