Method for fabricating circuit board with resilient seal as vapor barrier
US10622737B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2017 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Jun 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1338
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a circuit board apparatus includes providing a circuit board that has a socket with at least one plated through-hole and providing a connector that has a housing with first and second connector interfaces that have, respectively, at least first and second connector contacts. The first connector interface opens into an interior of the housing such that there is a vapor path through the first connector interface and interior of the housing to the second connector contact at the second connector interface. The first connector contact is inserted through the resilient seal and into the plated through-hole such that the resilient seal intimately seals around the first connector contact to provide a barrier at the first connector interface into the vapor path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.