Conductor shaping apparatus and method
US10622872B2 · kind B2 · utility
2Cited by
3References
21Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 13, 2014 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Apr 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K3/28
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conductor shaping apparatus with first and second shaping dies that are movable toward and away from each other along a first direction, and that are moved toward each other to shape the at least one first bent portion and the at least one second bent portion, wherein one of the first and second shaping dies is configured to be moved away from the other along a second direction that is different from the first direction such that the conductor is not dragged when the first and second shaping dies are moved away from each other along the first direction after shaping of the first and second bent portions is completed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.