Low-profile space-efficient shielding for SIP module
US10624214B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2016 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Aug 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.