First and second shields for thermal isolation
US10624240B2 · kind B2 · utility
8Cited by
16References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2016 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Apr 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20009
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An example device in accordance with an aspect of the present disclosure includes a first shield to provide thermal isolation between a first component and a heatsink of a second component, and to provide a cooling channel that is thermally isolated from the heatsink to receive an airflow for the first component. A second shield is to provide thermal isolation between the first shield and the heatsink, and to provide a thermal barrier region between the first shield and the second shield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.