Automotive power electronics assembly
US10624244B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 4, 2015 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Feb 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0203
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An automotive power electronics assembly, including: a cover plate, a cooling pipe received in a groove extending along a first surface of the cover plate, a plurality of metallic heat sink bodies provided on a second, opposite surface of the cover plate wherein first end faces of the hear sink bodies are in heat conducting contact with the cover plate, each heat sink body carrying on a side surface at least one semiconductor component to be cooled, and a printed circuit board providing electronic contacts to the semiconductor components, where the printed circuit board is in contact with second end faces of the heat sink bodies. Each heat sink body tapers from the first end face to the second end face such that the contact area with the cover plate is larger than the contact area with the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.