EMI shielding structure and manufacturing method therefor
US10624248B2 · kind B2 · utility
2Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2017 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Mar 11, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.