Footwear and the manufacture thereof
US10624416B2 · kind B2 · utility
29Cited by
19References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 16, 2018 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Aug 24, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2437/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An insole board for a high-heel shoe, said insole board includes a heel supporting area having a concave heel cup adapted to underlie a heel of the wearer, a medial arch support area adapted to underlie the arch of the wearer's foot and extending toeward of but short of the ball of the wearer's foot, and a forefoot area adapted to underlie the ball of the foot and forefoot of the wearer. The medial arch support area has a raised contour for supporting a portion of a sole of the wearer's foot underlying the wearer's arch, and the forefoot support area includes a hollow having a resiliently deformable material therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.