Method for monitoring quality of hot stamped components
US10625323B2 · kind B2 · utility
1Cited by
1References
18Claims
0Family size
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Key dates
| Filing date | Feb 19, 2016 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Jul 28, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D2211/008
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A controller alters a cycle time of a die arrangement, configured to hot stamp metal into components and having an active cooling system, based on an amount of heat transferred from the components to the active cooling system such that a grain structure of the components transitions from an austenitic state to a martensitic state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.