Laser processing method, apparatus for sapphire and storage medium
US10625375B2 · kind B2 · utility
0Cited by
7References
19Claims
0Family size
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Key dates
| Filing date | Apr 29, 2016 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Jun 8, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing method for a sapphire includes: acquiring an image of the sapphire during processing; performing an edge detection to the image to acquire a coordinate of a crack; determining an offset parameter according to the coordinate of the crack; adjusting a laser processing position according to the offset parameter; and further processing the sapphire in accordance with the adjusted laser processing position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.