Resin composition for printed circuit board, resin varnish using the same, adhesive film, prepreg and printed wiring board
US10626288B2 · kind B2 · utility
0Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2015 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Apr 8, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/024
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition for a printed circuit board includes an epoxy resin; an active ester hardening agent configured to react with the epoxy resin; and a cyanate ester hardening agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.