Adhesive composition and an article manufactured therefrom
US10626308B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2015 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Feb 2, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2467/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure relates to a B-stageable adhesive composition and an article prepared by the same. In the present disclosure, the adhesive composition comprises the following components in solid content percentage: (A) 10% to 50% by weight of a first epoxy resin with a weight average molecular weight Mw of 8,000 g/mol or more; (B) 5% to 20% by weight of a second epoxy resin with a weight average molecular weight Mw of 200 to 6,000 g/mol; (C) 30% to 80% by weight of a hydroxyl terminated polyester or derivates thereof; (D) 0.1% to 2.5% by weight of a first curing agent capable of reacting with epoxy group; and (E) 0.1% to 2.5% by weight of a second curing agent capable of reacting with hydroxyl group; the sum of components of the composition is equal to 100% by weight. The coating obtained from the adhesive composition of the present disclosure shows high adhesive strength, excellent heat resistance and flame retardance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.