Apparatus for testing semiconductor package
US10627441B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2017 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Jun 5, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2029/5602
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor package test apparatus includes a handler, a test board, and a board temperature controller. The handler includes a first heater and cooler to heat and cool a semiconductor package. The test board tests the semiconductor package, and includes main test board having a test socket and a base test board spaced from the main test board. The board temperature controller includes a second heater and cooler to heat and cool the main test board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.