Panel module and display device
US10627662B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2018 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Nov 1, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A panel module includes a bonding resin layer between a first main face of a first substrate and a second main face of second substrate, and a bond made of cured adhesive. At least a part of an outer end face of the bonding resin layer is located inner than an outer end face of the first substrate and an outer end face of the second substrate. The bond has a stronger bonding force and a higher elasticity than the bonding resin layer. The bond is attached to a first region of the first main face and a second region of the second main face in an area outer than the bonding resin layer. The bond is attached to a third region of the outer end face of the second substrate and a fourth region of the first main face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.