Heat dissipating structures and mobility apparatus for electronic headset frames
US10627862B1 · kind B1 · utility
0Cited by
10References
20Claims
0Family size
Inventors
Key dates
| Filing date | Jun 7, 2019 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Jun 7, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat sink for electronic devices, such as wearable displays, dissipates heat away from and electrical component, such as a microprocessor. An adjustable support assembly permits adjustment of a visual display relative to a user's field of view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.