Molded module
US10629521B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2014 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Apr 8, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02P27/06
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An object of this invention is to obtain a molded module with which improvements are achieved in the packaging ability and heat dissipation performance of an inverter module itself, and in the mounting capacity of a peripheral mounting component such as a substrate, which must be taken into consideration in relation to the shape of the module. Provided is a molded module for use in power electronics, having an inbuilt semiconductor element used to supply and control a large amount of power, the molded module including at least one semiconductor switching element provided in the module and a lead frame that dissipates heat from the switching element and electrically connects an element packaged in the module to an external circuit, wherein at least one end of the module is molded in a curved shape or a polygonal shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.