Optical proximity sensor arrangement and method for producing an optical proximity sensor arrangement
US10629576B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2017 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Apr 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/413
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An optical proximity sensor arrangement comprises a semiconductor substrate (100) with a main surface (101). A first integrated circuit (200) comprises at least one light sensitive component (201). The first integrated circuit is arranged on the substrate at or near the main surface. A second integrated circuit (300) comprises at least one light emitting component (301), and is arranged on the substrate at or near the main surface. A light barrier (400) is arranged between the first and second integrated circuits. The light barrier being designed to block light to be emitted by the at least one light emitting component from directly reaching the at least one light sensitive component. A multilayer mask (500) is arranged on or near the first integrated circuit and comprising a stack (501) of a first layer (502) of first elongated light blocking slats (503) and at least one second layer (504) of second elongated light blocking slats (505). The light blocking slats are arranged in the mask to block light, incident on the mask from a first region of incidence (701), and to pass light, incident on the mask from a second region of incidence (702), from reaching the at least one light sen…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.