Printed circuit board, electronic device and heat conduction sheet
US10631397B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 21, 2019 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Oct 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0022
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a printed wiring board having a mounting surface facing a first side, an electronic element provided on the mounting surface, a heat dissipation member disposed on the first side with respect to the electronic element, and a heat conduction member disposed between the electronic element and the heat dissipation member and having a first surface facing the first side and a second surface facing a second side opposite to the first side. The heat conduction member has a high relative magnetic permeability portion and a low relative dielectric constant portion. The high relative magnetic permeability portion surrounds the low relative dielectric constant portion on at least the second surface of the heat conduction member. At least part of the low relative dielectric constant portion overlaps the electronic element in a plan view seen in a direction perpendicular to the mounting surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.