Patent · US Active

Field device with a component for filling potting compound

US10631421B2 · kind B2 · utility

0Cited by

2References

5Claims

0Family size

Assignee

Endress+Hauser SE+Co. KG · DE

Inventors

Christian Seiler · Auggen, DE
Willy Huwyler · Baar, CH
Silvio Moser · Hausen, CH

Key dates

Filing date	Jul 26, 2016
Grant date	Apr 21, 2020
Priority date	—
Expiry date	Sep 20, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB29L2031/34
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

The invention relates to a field device of automation technology with an opened housing and an electronics part in the housing, comprising at least one component for filling potting compound into the housing, wherein the component has a trough, in order to conduct the potting compound, with targeting, to a location of the housing to be potted.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.