Patent · US Active

Carrier substrate for an optoelectronic semiconductor component

US10632655B2 · kind B2 · utility

1Cited by

1References

16Claims

0Family size

Assignee

Osram OLED GMBH · DE

Inventors

Stephan Eicher · Arnstorf, DE
Martin Brandl · Kelheim, DE
Markus Boss · Regensburg, DE

Key dates

Filing date	Aug 11, 2016
Grant date	Apr 28, 2020
Priority date	—
Expiry date	Aug 11, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/036
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A method of producing a carrier substrate for an optoelectronic semiconductor component includes: providing a leadframe including a first electrically conductive contact section and a second electrically conductive contact section, and injection molding a housing including a housing frame embedding the leadframe by an injection-molding material free of epoxy such that the leadframe embedded in the housing frame of the injection-molded housing forms a carrier substrate for an optoelectronic semiconductor component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.