Patent · US Active

Multilayer structural adhesive film

US10632707B2 · kind B2 · utility

1Cited by

9References

19Claims

0Family size

Assignee

3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

Elisabeth Cura · Düsseldorf, DE
Sohaib Elgimiabi · Düsseldorf, DE
Stefan B. M. Luebbe · Essen, DE
Kotaro Shinozaki · Kyoto, JP
Saori Ueda · Moriyama, JP

Key dates

Filing date	Nov 14, 2016
Grant date	Apr 28, 2020
Priority date	—
Expiry date	Nov 14, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB32B2607/00
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The invention relates to the use of a structural adhesive film for bonding and sealing a hem flange connection between panels. The structural adhesive film comprises at least one adhesive layer and at least one layer with a porous structure. The adhesive layer comprise an epoxy compound as well as an epoxy curing agent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.