Polymer resin compound and photosensitive resin composition for black bank comprising same
US10633486B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Feb 27, 2018 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Feb 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/173
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polymer resin compound, a photosensitive resin composition for a black bank comprising the polymer resin compound, and a method for manufacturing a black bank. The method comprises coating the photosensitive resin composition on a substrate to form a photosensitive resin film; exposing and developing the photosensitive resin film to pattern the coated photosensitive resin film; and curing the patterned photosensitive resin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.