Automatic bonding force calibration
US10634572B2 · kind B2 · utility
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1References
14Claims
0Family size
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Key dates
| Filing date | Jun 14, 2016 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Dec 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/783
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A calibration method for a bonder. Characteristics of a force actuator of the bonder are measured and stored in such a way that the force actuator can be controlled optimally during production operation of the bonder on the basis of the measured data. Further, a device for fully automatic or partially automatic bonding force calibration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.