Enhanced cleaning for water-soluble flux soldering
US10636763B2 · kind B2 · utility
0Cited by
17References
18Claims
0Family size
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Key dates
| Filing date | Sep 15, 2017 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Sep 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81948
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.