Wafer-level optical structure
US10636829B1 · kind B1 · utility
0Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2018 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Oct 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wafer-level optical structure includes at least two optical lens sets disposed on an optically transparent wafer, at least one trench disposed between two adjacent optical lens sets to divide the two adjacent optical lens sets, at least one spacer disposed between two adjacent optical lens sets to be correspondingly and partially disposed in the trench, and an adhesive disposed inside the trench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.